Semicon 56 – 57 Highlights 2025 Reduce nitrogen consumption by up to 18% Even a small saving per FOUP has a positive effect on the entire factory. The Festo experts calculate that, by using new technologies, the amount of nitrogen used can be reduced to the absolute minimum necessary. The innovative solution from Festo reduces nitrogen consumption for the FOUPs by 75% by controlling the flushing process. The investment will pay for itself after just three months. Verified sample calculation Actual state: A plant with 10,000 FOUPs without an N2 Purge system from Festo consumes up to 550,000 tons of nitrogen per year. Amount of N2 saved by the N2 purge system By using a regulated flow, the flow rate can be reduced from 20 SLPM to 5 SLPM (standard liters per minute) per FOUP. This results in a reduced, permanent flow rate of 15 SLPM in the system. » By reducing the flow rate, up to 75% can be saved per FOUP, reducing the factory’s total nitrogen consumption by up to 18%. View of a semiconductor factory with Overhead Transport System (OHT), which automatically places FOUPs with the substrates/wafers on the production machines. Flow regulator VEAD The very affordable, pre-assembled flow controller for CDA and inert gases continuously supplies the wafer reservoir (FOUP) with inert nitrogen, thus preventing oxygen from oxidizing the wafers. Mass flow controller VEFC The compact flow regulator for inert gases has all the advantages of piezo valves: Maximum dynamic response, infinitely variable precision, low power consumption, and a stable flow without the need for manual adjustment. Examples of Festo valves with piezo technology
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